Technical Glossary (2260 terms)

Standardized hardware and benchmark definitions across smartphones, laptops, CPUs, GPUs, SoCs, and tablets.

• HDR photo — A photo merged from multiple exposures for more range. [ CAMERA ]
• HDR playback — Chips [ CHIPS ]
• HDR video — Video with wide dynamic range for HDR displays. [ CAMERA ]
• HDR10 — The baseline HDR format with fixed metadata; HDR10+ adds dynamic per-scene metadata. [ DISPLAY ]
• HEIC — The efficient image format used by Apple. [ CAMERA ]
• HMB — Host Memory Buffer — an SSD using a slice of system RAM as cache. [ STORAGE ]
• HMD Global — Company licensed to make Nokia-branded phones. [ BRANDS ]
• HP — US PC maker known for Spectre, Envy, Pavilion, EliteBook, and Omen computers. [ BRANDS ]
• HP Omen 16 — HP's gaming laptop — launched in 2024. [ PRODUCT LINES ]
• HP Spectre x360 14 — HP's premium convertible laptop — launched in 2024. [ PRODUCT LINES ]
• HSPA — High-Speed Packet Access — a 3G enhancement. [ CONNECTIVITY ]
• HSPA+ — Evolved HSPA, sometimes called 3.5G. [ CONNECTIVITY ]
• Harman Kardon — Audio brand known for premium speakers and laptop audio tuning. [ BRANDS ]
• HarmonyOS — Huawei's operating system. [ SOFTWARE ]
• Hasselblad — Camera [ CAMERA ]
• Hawk Point — AMD codename for the Ryzen 8040 mobile APU generation. [ CHIPS ]
• Headphone Jack — The 3.5mm analog audio output; increasingly omitted on flagship phones. [ PORTS ]
• Helio — MediaTek's budget and midrange SoC line. [ BRANDS ]
• Helio G80 — Chips [ CHIPS ]
• Helio G85 — Chips [ CHIPS ]
• Helio G88 — Chips [ CHIPS ]
• Helio G95 — Chips [ CHIPS ]
• Helio G99 — Chips [ CHIPS ]
• Helio P95 — Chips [ CHIPS ]
• Hertz — The unit of frequency — cycles per second. [ GENERAL ]
• Hi-Res Audio — Audio quality beyond CD standard. [ AUDIO ]
• HiSilicon — Huawei's chip design division behind the Kirin SoCs. [ BRANDS ]
• Honor — Chinese phone brand (formerly Huawei) known for Magic and X-series devices. [ BRANDS ]
• Honor 300 — Honor's midrange phone with good cameras launched in 2025. [ PRODUCT LINES ]
• Honor Magic — Honor's flagship line. [ PRODUCT LINES ]
• Honor Magic 7 — Honor's flagship with a large battery launched in 2025. [ PRODUCT LINES ]
• Honor Magic 8 Pro — Honor's pro flagship launched in 2026. [ PRODUCT LINES ]
• Honor X — Honor's value-to-midrange line. [ PRODUCT LINES ]
• Hopper — NVIDIA's data-center GPU architecture (H100). [ CHIPS ]
• Huawei — Chinese tech giant making Mate, P/Pura, and nova phones plus Kirin chips and HarmonyOS. [ BRANDS ]
• Huawei Mate — Huawei's large-screen flagship line. [ PRODUCT LINES ]
• Huawei Mate 70 Pro — Huawei's flagship with Kirin 9100 launched in 2024. [ PRODUCT LINES ]
• Huawei Pura — Huawei's premium camera line, formerly the P series. [ PRODUCT LINES ]
• Huawei Pura 70 Ultra — Huawei's pro camera flagship launched in 2024. [ PRODUCT LINES ]
• Huawei Pura 80 — Huawei's premium camera line launched in 2025. [ PRODUCT LINES ]
• Huawei nova — Huawei's stylish midrange line. [ PRODUCT LINES ]
• HyperOS — Xiaomi's operating system. [ SOFTWARE ]
• HyperOS 2 — Software [ SOFTWARE ]
• IBM — US company behind POWER processors, mainframes, and early PC architecture. [ BRANDS ]
• IEEE — Institute of Electrical and Electronics Engineers — publishes Wi-Fi (802.11) and Ethernet standards. [ BRANDS ]
• IGZO — Indium Gallium Zinc Oxide — a high-performance transistor backplane material. [ DISPLAY ]
• INT8 — 8-bit integer precision, common for quantized AI inference. [ CHIPS ]
• IOPS — Input/Output operations per second — a storage performance metric. [ STORAGE ]
• IP53 — Dust-protected and spray-resistant. [ DURABILITY ]
• IP54 — Dust-protected and splash-resistant. [ DURABILITY ]